Cu – Interconnects, Glass, and AI – Assisted Simulation for Chiplets and Heterogeneous Integration | 72.84 MB
Title: Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
Author: John Lau, Xuejun Fan
Category: Nonfiction, Science & Nature, Science, Physics, Solid State Physics, Technology, Electronics, Circuits
Language: English | 566 Pages | ISBN: 9789819641666
Artificial Plasmonics for VLSI Interconnects Bridging the Gap Between Electronics and Optics (TrueRetail PDF) | 6.56 MB
Title: Artificial Plasmonics for VLSI Interconnects
Author: Soumitra R. Joy;Pinaki Mazumder;
Category: Nonfiction, Science & Nature, Technology, Electronics, Circuits, Computers, Advanced Computing, Programming, Data Modeling & Design, Material Science
Language: English | 307 Pages | ISBN: 9781394289967